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天津快乐十分走势-僵尸病毒

天津快乐十分走势

半导体(512480)融资融券信息(04-03)

K图 512480_0半导体(512480)2020-04-03融资融券信息显示,半导体融资余额278,094,646元,融券余额0元,融资买入额33,099,965元,融资偿还额30,597,332元,融资净买额2,502,633元,融券余量0股,融券卖出量0股,融券偿还量0股,融资融券余额278,094,646元。半导体融资融券详细信息如下表:交易日期代码简称融资融券余额(元)2020-04-03512480半导体278,094,646融资余额(元)融资买入额(元)融资偿还额(元)融资净买额(元)278,094,64633,099,96530,597,3322,502,633融券余额(元)融券余量(股)融券卖出量(股)融券偿还量(股)0000沪市全部融资融券数据一览 半导体融资融券数据

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